HY510 Thermal Grease Compound Silicone CPU Heat Sink Cooling Paste

Product Overview: A high-performance thermal compound designed to improve heat dissipation between CPUs, GPUs, and their heat sinks, ensuring optimal cooling efficiency. Key Features: ‣ High thermal conductivity for efficient heat transfer. ‣ Low thermal resistance minimizes thermal impedance. ‣ Non-conductive material ensures safety for electronic components. Technical Specifications: ‣ Material: Silicone-based compound (grey). ‣ Compatibility: Suitable for CPUs, GPUs, LEDs, and other electronic components.